Cirtek Electronics Corp

Dynacraft manufactures QFP lead frames in many configurations. A wide variety of open tools are available in matrix formats. Internal lead pitch is minimized to shorten gold wire length. Some frames have epoxy locks around the die-attach pad for enhanced package reliability. Stamping tools are...

Open tooling offers inexpensive lead frame solutions to new package introduction. Using open tools eliminates costly non-recurring investments. Dynacraft endeavours to meet the dynamic challenges demanded by our customers. New open tools are made available frequently.

Forecasts of the demise through hole packages are premature. Current volumes of plastic DIP are second only to SOIC/SOP packages. Dynacraft has one of the largest selections of open-tooled plastic DIP frames. It ranges from 8 to 40 leads - in standard tip-to-tip and in interdigitated (IDF)...

Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts. GENERAL SPECIFICATIONS SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature PCB: 0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26 with 1-oz. Cu traces, both sides finished...

We offer almost 150 surface mount feet for QFP interfaces. Our proprietary shaped solder technology, gull wing leads, or leadless systems are employed to attach the part to the SMT lands. These parts present our MGA (.05" pitch "mini-grid") array of gold plated pins to provide pluggable connections.

Our SOIC surface mount feet are offered in leadless (-L), J-leaded (-J), or bottom termination (-K) variations. When soldered to the target SMT lands, they create a pluggable connection by presenting an array of gold plated pins. Some of these parts utilize our proprietary .0315" pitch "micro-grid"...

Our Plastic Dual-In-Line Package (PDIP) is frequently used in consumer electronic products, including games, telephones, televisions, audio equipment and computer peripherals. The PDIP is available in 8 to 40 lead counts.

Our leadless with an exposed pad option is available in two versions, QFN is a quad flat leadless package and the other is DFN normally dual flat leadless package. These packages are available in three package thickness, the 0.9MM, 076MM and the ultra thin version of 0.50MM. The QFN has four sides...

Surface mount Land Sockets (or Chip Carriers) are a cost effective and highly reliable alternative to ZIF sockets. Our land sockets provide a top interface of SMT lands (BGA or QFP) for mounting your device, while the bottom interface presents a through-hole pin configuration. Land sockets can be...

Our Small Outline Integrated Circuits (SOIC) are designed for applications that require reduced size. For example, you might find the SOIC in pagers, cordless phones, fax machines, copiers, printers, computer peripherals A/V products and automotive systems. It is available in 8 to 28 lead counts